(VOVWORLD) - The Vietnam National Innovation Center (NIC) signed an agreement of cooperation with Arizona State University (ASU) for semiconductors, microelectronics, and other related disciplines relevant to Vietnam’s technology and innovation supply chain.
 Jeffrey Goss,Vice Provost of AUS, and Vo Xuan Hoai, NIC Deputy Director (R), at the signing ceremony on September 19, 2023. (Photo credit: NIC)
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ASU is the largest comprehensive public research university in the US with over 140,000 students and 671 million USD in annual research expenditures.
It has the largest engineering school in the US with expansive research capabilities and its annual training programs (ATP) in microelectronics and semiconductors, manufacturing, and integrated circuit (IC) design.
NIC, of the Ministry of Planning and Investment, is building up the infrastructure for an IC design incubation center at Hoa Lac High Tech Park in Hanoi, Vietnam.
Within the cooperation structure, ASU will introduce job opportunities for Vietnamese engineers trained at NIC’s IC design center for specialized training and incubation with domestic and foreign businesses in the semiconductor industry, including linkages to Arizona’s large global semiconductor ecosystem.
 The MoU between NIC and ASU is expected to further develop Vietnam’s current semiconductor and innovation ecosystem, workforce, and other related desciplines needs. (Photo: Vietnam+)
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ASU will facilitate further partnerships with governments, organizations, businesses, and corporations in the semiconductor industry in the US and around the world to support ASU and NIC’s collaboration to develop the Vietnamese semiconductor ecosystem and deeply participate in the global semiconductor supply chain.
Both sides will jointly explore opportunities for startups to bi-laterally link the ASU Innovation Zones across Phoenix, AZ with the NIC in Hanoi to foster US and Vietnamese start-up and innovation semiconductor ecosystems.
 Karna Nisewaner, Cadence's General Counsel and Corporate Vice President, and NIC Deputy Director Vo Xuan Hoai (R) at the signing ceremony. (Photo credit: NIC)
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On the same day, NIC also signed a cooperation agreement with Cadence Design Systems (Nasdaq: CDNS) to accelerate IC design innovation in Vietnam.
Through the collaboration, NIC will provide Vietnam universities, training centres, and start-up companies with the technology and education required to design and develop products for the fast-growing, local semiconductor and electronics ecosystem.
Cadence will provide access to its tools to academic institutes selected by NIC, providing students with an opportunity to gain real-world experience creating innovative IC designs.
The signing of the agreements was witnessed by Prime Minister Pham Minh Chinh who is attending the high-level week of the United Nations General Assembly’s 78th session, US Ambassador to Vietnam Marc Knapper, President and CEO of the US’s Semiconductor Industry Association John Neuffer, among others.