Vietnam’s first semiconductor chip manufacturing plant breaks ground

(VOVWORLD) - Construction of Vietnam’s first semiconductor chip manufacturing plant began at Hoa Lac High-Tech Park in Hanoi on Friday, marking the 14th National Party Congress. 
Vietnam’s first semiconductor chip manufacturing plant breaks ground - ảnh 1Party General Secretary To Lam, Prime Minister Pham Minh Chinh, and other senior officials press the buttons to launch Vietnam’s first semiconductor chip manufacturing project, Hanoi, January 16, 2025. 

The groundbreaking ceremony was attended by Party General Secretary To Lam and Prime Minister Pham Minh Chinh.

PM Chinh said the project marks a major step toward mastering high technology and completing a critical link in the semiconductor value chain, signaling Vietnam’s transition from participation to mastery, and from assembly to innovation.

“It is crucial to build a strong semiconductor enterprise base to complete the domestic value chain and effectively connect with the FDI sector and global supply chains. By 2030, Vietnam aims to have at least 100 chip design firms, one chip manufacturing plant, around 10 assembly, packaging and testing facilities, and more than 50,000 engineers and graduates, ensuring both the quantity and quality of human resources across all stages,” he said. 

The project, invested in and implemented by the Military Industry and Telecommunications Group (Viettel), is expected to serve as national infrastructure for semiconductor research, design, testing, and production.

Once operational, the plant will support key sectors including aerospace, telecommunications, the Internet of Things (IoT), automobile manufacturing, medical devices, and automation.

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